Customization: | Available |
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CAS No.: | 63148-60-7 |
Formula: | Ho-Si(CH3)2o[Si(CH3)2o]Nsi(CH3)2-Oh |
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1. Single component, easy to use, good extrudability and thixotropy in the temperature range of 4°C ~ 40°C, can be applieddirectly by using a glue gun;
2. After curing, it will not become brittle, harden or crack at low temperatures of -30°C. It will not soften or degrade at high temperatures, but will shrink to a certain extent and increase in hardness;
3. Excellent weathering resistance, aging, UV, ozone and water resistance;
4. Excellent resistance to high and low temperatures, will not become brittle, hardened or cracked at -30°C after curing and will not become soft and degraded at high temperatures, but there is a certain shrinkage, and the hardness has increased;
5. Good adhesion, forming a strong seal with most building materials when cured without the need for a primer;
6. Good compatibility with other neutral silicone adhesive;